From November 3 to 6, 2024, PACK EXPO International will be held at McCormick Place in Chicago, IL, and Matiss is pleased to announce its participation again this year!
With vendors from over 40 industries that specialize in packaging and processing solutions and equipment, this much awaited event is the perfect occasion to explore the most recent innovations, discover new products, and exchange and network with your peers.
MatissEquipment’s and Matissoft’s teams will be on-site to present our cutting-edge solutions. Discover how our ROBOTIC SOLUTIONS, ULTRASONIC CUTTING equipment, and advanced MES and SCADA TECHNOLOGIES can make you more competitive in the manufacturing of your products.
Join us to discover and chat about all our solutions with our experts!
Book a meeting now or drop by our booth #S-2381.
